ANSYS® 14.5 Bolsters Product Performance and Integrity Through
Deeper Design Insight
PITTSBURGH, Nov. 13, 2012 /PRNewswire/ -- Building upon its
comprehensive portfolio of advanced multiphysics engineering
simulation technology, ANSYS (NASDAQ: ANSS) today released version
14.5 to further support an integrated and streamlined approach to
design exploration and the creation of a complete virtual
prototype. New multiphysics capabilities are seamlessly brought
together with the ANSYS Workbench platform to deliver unmatched
engineering productivity and innovation.
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In the real world, product performance varies by operating
conditions, consumer usage, manufacturing processes and material
properties. As products become increasingly complex, it is more
challenging for engineers to fully understand the performance
implications of design variations. Multiphysics simulation
technology enables companies to make informed decisions based on
insight gained from these analyses to deliver optimal results.
Built on a platform that streamlines workflow among simulation
applications, ANSYS 14.5 delivers many new and critical
multiphysics solutions, enhancements to pre-processing and meshing
capabilities as well as a new parametric high-performance computing
(HPC) licensing model to make design exploration more scalable.
"It's no secret that while today's products are getting smarter,
they're also becoming more complex," said Jim Cashman, president and CEO at ANSYS. "Having
a holistic view of the product requirements and design is crucial
to reduce design uncertainty and ultimately create a successful
product. Our customers are depending on the depth and breadth of
ANSYS 14.5 and our Workbench platform to confidently predict how
their products will perform and, at the end of the day, provide
good value and satisfaction to their customers."
NEW PARAMETRIC LICENSING SOLUTIONS FOR DESIGN
EXPLORATION
ANSYS 14.5 builds on a tradition of HPC leadership. The technology
supports robust design exploration via a combination of Workbench's
enhanced parametric simulation technology with improved job
management and a new HPC licensing solution that enables scalable
throughput computing.
Specifically, the new HPC Parametric Pack amplifies the
available licenses for individual applications (pre-processing,
meshing, solve, HPC, post-processing), enabling simultaneous
execution of multiple design points while consuming just one set of
application licenses.
CHIP–PACKAGE–SYSTEM DESIGN FLOW
To meet increasing market demands of higher performance, smaller
size and lower-cost electronics, the design of electronic chips,
packages and systems requires an integrated analysis and
verification methodology. To resolve these challenges, ANSYS 14.5
introduces the first chip–package–system (CPS) design flow on the
market. This coupled approach addresses multidisciplinary
requirements from the first phase of the design process and results
in a final product whose individual components work together as an
integrated system.
ANSYS 14.5's new CPS design flow links ANSYS subsidiary Apache
Design's integrated circuit (IC) power analysis products to ANSYS'
electromagnetic field simulation products. Additionally, the power
delivery network channel builder automatically connects electronic
package models from ANSYS SIwave™ to IC power simulations in
Apache's RedHawk™ and Totem™ for increased convenience.
ADVANCED MESHING SOLUTIONS
Users of ANSYS 14.5 can create higher-fidelity simulation results
faster. ANSYS TGrid™ functionalities are integrated in the ANSYS
Fluent® environment in version 14.5 to further reduce
pre-processing time. CAD readers and new advanced surface meshing
capabilities are also integrated and available in a single user
environment. Additionally, meshing enhancements allow for
higher-quality hexahedral meshes that result in smaller problem
size and overall reduced solver time.
COMPLEX 3-D COMPOSITES SHAPE SIMULATION
The use of
composites parts across different industries is growing due to
their ability to reduce the weight of a product. While many
composites can be efficiently modeled as thin structures, some
complex geometries, such as turbine blades, pressure vessels and
automotive structures, require the setup of 3-D models and their
inclusion within larger assemblies made of non-composites parts.
ANSYS Workbench provides the necessary framework and streamlined
workflow in version 14.5 to further improve the ability to create
3-D layered composites from complex geometry and conveniently
combine them with non-composites parts in global assemblies.
EXTENDED FLUID–THERMAL MULTIPHYSICS CAPABILITIES
Continuing its history of innovation in multiphysics, ANSYS 14.5
introduces extended fluid–thermal capabilities, such as two-way
coupling between fluid simulation in ANSYS Fluent and
electromagnetic field simulation in ANSYS Maxwell®. The
ANSYS Workbench platform supports the efficient coupling of
multiple physics models and, when paired with this new feature,
users can quickly and accurately predict losses and understand the
effects of temperature on material performance in electromechanical
devices such as motors and transformers.
A holistic solution for one-way thermal–fluid–structure
interaction (FSI), ANSYS system coupling supports a wide variety of
one-way thermal FSI workflows, which promotes higher-fidelity
simulations. Furthermore, the robustness of coupled two-way
force/displacement FSI is enhanced, allowing engineers to gain
insight into their complete products more quickly and with less
hassle. A global liquid food packaging and processing leader, Tetra
Pak, has seen marked improvements with 14.5's new two-way FSI
capabilities:
"Historically, simulating two-way FSI has been an incredibly
time-consuming and complex process and, in some applications, not
even possible," said Ulf Lindblad,
technology specialist at Tetra Pak. "The solution stabilization
algorithm implemented in ANSYS 14.5 broadens the range of
applications where we can execute this difficult task with
increased accuracy and efficiency. Designing our systems with
optimized FSI will ultimately lead to improved machine performance
for our customers and improved package performance for their
consumers."
ESTEREL TECHNOLOGIES SCADE SUITE® COUPLING WITH
ANSYS SIMPLORER®
A systems-level engineering
approach that brings hardware and software together earlier in the
design process is crucial to avoiding design errors being
introduced at a point when changes are costly.
With the integration of recently acquired ANSYS subsidiary
Esterel Technologies' SCADE Suite with ANSYS Simplorer in version
14.5, companies can virtually validate power electronic and
mechatronic systems earlier in the design process by simulating the
embedded software with the hardware, including electrical,
mechanical and fluidic subsystems. This capability increases the
design fidelity and boosts confidence that products will perform as
expected in the real world.
ANSYS HFSS™ FOR ECAD INTEGRATION
As companies face pressure to do more with their current
engineering resources, ANSYS 14.5 further streamlines the design
workflow and introduces ANSYS HFSS for ECAD. This capability
contributes to accuracy by enabling engineers to run complex 3-D
HFSS simulations directly from the ANSYS Designer layout-based
interface and from other popular layout-based ECAD
environments.
Scott McMorrow, director of
engineering at Teraspeed Consulting Group LLC, has chosen to switch
to ANSYS HFSS, ANSYS DesignerSI™ and SIwave after using a
competitor's electromagnetic modeling and simulation products for
nearly 10 years. "After a two-year extensive evaluation and
measurement correlation of the ANSYS tools against multiple
industry products, the measurement comparisons have shown that the
ANSYS solutions are robust and accurate across the widest range of
applications and structures. We found through detailed measurement
testing that HFSS is truly the 'golden standard' in electromagnetic
modeling. When the structures we measured were modeled faithfully
and the material properties were characterized and entered
accurately, ANSYS HFSS produced extremely accurate results with no
discernible difference between measured and modeled results."
ANSYS version 14.5 is available for download via the ANSYS
Customer Portal: https://www1.ansys.com/customer/default.asp
Related images are available for download by the media at:
http://www.ansys.com/newsimages
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex
design challenges through fast, accurate and reliable engineering
simulation. Our technology enables organizations ― no matter their
industry ― to predict with confidence that their products will
thrive in the real world. Customers trust our software to help
ensure product integrity and drive business success through
innovation. Founded in 1970, ANSYS employs approximately 2,400
professionals, many of them expert in engineering fields such as
finite element analysis, computational fluid dynamics, electronics
and electromagnetics, and design optimization. Headquartered south
of Pittsburgh, U.S.A., ANSYS has more than 65 strategic sales
locations throughout the world with a network of channel partners
in 40+ countries. Visit www.ansys.com for more information.
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries.
All other brand, product, service and feature names or
trademarks are the property of their respective owners.
Technology: ANSS-T
Contact
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Media
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Jackie
Mavin
724.514.3053
Jackie.mavin@ansys.com
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Investors
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Annette
Arribas
724.514.1782
annette.arribas@ansys.com
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SOURCE ANSYS, Inc.