Xilinx Corporate VP Liam Madden to Deliver Keynote at 3-D
Architectures for Semiconductor Integration & Packaging
Conference
SAN JOSE, Calif., Dec. 5, 2012 /PRNewswire/ -- Xilinx,
Inc. (NASDAQ: XLNX) today announced that Xilinx corporate vice
president, Liam Madden, will deliver
a keynote address at the 3D Architectures for Semiconductor
Integration & Packaging conference taking place next week at
the Sofitel San Francisco Bay hotel in Redwood City, Calif., December 12-14, 2012.
(Logo: http://photos.prnewswire.com/prnh/20020822/XLNXLOGO)
Madden will open the Critical Perspectives on 3D IC keynote
session on Thursday morning, followed by executives from Micron
Technology, Cadence Design Systems, Global Foundries and
Ericsson. Speakers will delve into 3D IC opportunities and
challenges facing the industry from the perspective of
semiconductor, EDA, foundry and systems companies.
|
What:
|
3D
Architectures for Semiconductor Integration &
Packaging
|
|
Where:
|
Sofitel
San Francisco Bay
|
|
When:
|
December
12-14, 2012
|
Thursday, December
13
8:00 a.m. - 8:30
a.m.
Advancing High Performance Heterogeneous Products through Die
Stacking
Today's 3D die stacking technology increases
aggregate inter-chip bandwidth and shrinks board footprint while
reducing I/O latency and energy consumption. By integrating in one
package multiple tightly-coupled semiconductor dice, this
technology gives system designers additional options to partition
and scale solutions efficiently.
In his talk, Madden will describe historical and current
challenges driving the need for radical improvements in
system-level IC integration; economic and technology forces that
have aligned to enable 3D IC 'stacking' technology; pioneering
advancements resulting in delivery of the world's first All
Programmable homogeneous and heterogeneous 3D FPGAs; and examples
of key applications already benefiting from today's 3D
heterogeneous FPGAs. Madden's talk will conclude with an overview
of key 3D challenges facing our industry.
About the 3-D Architectures for Semiconductor Integration
& Packaging Conference
The 3-D Architectures for
Semiconductor Integration and Packaging Conference is part of RTI
(Research Triangle Institute) International's Technology Venture
Forum Series, which seeks to provide insight on the impact of
significant emerging technologies. For more information on the
conference, please visit:
http://techventure.rti.org/index.html.
About Xilinx
Xilinx is the world's leading provider of
programmable platforms. For more information, visit:
http://www.xilinx.com/.
#1289e
Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex,
Zynq, and other designated brands included herein are trademarks of
Xilinx in the United States and
other countries. All other trademarks are the property of their
respective owners.
|
Xilinx,
Inc.
Lisa
Washington
408-626-6272
lisa.washington@xilinx.com
|
SOURCE Xilinx, Inc.